12kV固体柜环氧浇注模块外表面无金属化层时的电场分布特征研究

Research on the Electric Field Distribution Characteristics of 12 kV Solid Epoxy Mold Insulated Switchgear Without Surface Metallization

固体绝缘技术在中压特别是12 k V开关设备当中已经得到广泛的认可与应用。为实现固体柜产品小型化、提高耐候性、安全性等目的,在固体柜绝缘表面进行金属化处理成为当前新的研究热点。但目前固体柜产品中很大一部分环氧浇注外表面未做金属化处理,文中对现有12 k V固体柜产品环氧浇注模块外表面无金属化处理时的电场分布特征进行了仿真研究。仿真结果表明,现有固体柜产品环氧浇注模块外表面无金属化层时,固体柜能够满足电场绝缘考核要求,但环氧浇注模块内部真空灭弧室结构及环氧模块与柜体外壳间隙距离对固体柜的电场分布影响显著。

Solid insulation technology has been widely used in medium voltage,especially 12 kV switchgears. For the purpose of miniaturization, weather ability and safety of the solid insulated switchgear（SIS）, metallization treatment on insulation surface has attracted more attention in corresponding researches. However, a large proportion of the commonly used SISs are not treated by metallization on the outer surface of epoxy mold. In this study,the electric field distribution characteristics on the epoxy mold of the 12 kV switchgear without surface metallization are simulated. The results show that the SISs without metallization on epoxy mold surface can satisfy the requirement for electric field assessment, but the internal vacuum interrupter structure in epoxy mold and the distance between epoxy mold and cabinet shell have significant influence on a SIS electric field distribution.