预浸带热压接机制与机构设计

Hot-press bonding mechanism and mechanism designing for prepreg

为满足复合材料自动铺缠成型过程中预浸带换料续接对效率及可靠性的要求,首先,根据流变学原理及Gutowski铺放贴合分析方法建立了热压接模型;然后,应用幂律模型建立了树脂流体在平行板挤压下的控制方程;最后,分析了静态续接状态和动态续接状态下续接强度与续接压力、树脂黏度、续接温度、续接时间(或续接速度)和续接长度的关系,并设计了静态和动态热压接机构。结果表明:随续接压力、续接温度、续接时间和续接长度的提升,预浸带的续接强度提高。所得结论可帮助设计满足快速、稳定及可靠等要求的续接机构,为预浸带快速热压接系统的开发奠定了理论与设计基础。

In order to satisfy the requirement of efficiency and reliability for prepreg change bonding during com-posite automatic placement and winding process,based on rheology theory and Gutowski analytical method of layup, hot-press bonding model was established firstly.Then,the control equation of resin fluid under parallel plate squee-zing was established by power law model.Finally,the relationship between bonding strength and bonding pressure, resin viscosity,bonding temperature,bonding time （or bonding velocity）as well as bonding length in static bonding state and dynamic bonding state were analyzed,and static and dynamic hot-press bonding mechanisms were de-signed.The results show that the bonding strength of prepreg increases with the increase of bonding pressure, bonding temperature,bonding time and bonding length.The conclusions obtained can help to design the bonding mechanism which satisfies the requirements for fast,stable and reliable etc.,and lay the theoretical and designing foundations for the development of prepreg rapid hot-press bonding system.