嵌入HNBR阻尼薄膜的共固化复合材料制作研究

Study on Preparation of Embedded Low-temperature Co-curing High Damping Fiber/Resin Composite

提出一种可以与玻璃纤维/环氧树脂预浸料共固化的HNBR高阻尼黏弹性材料,提出使用四氢呋喃(THF)作为溶剂,将该高阻尼材料制成原胶料溶液,采用双面刷涂工艺,将玻璃纤维/环氧树脂复合材料制成带阻尼薄膜的预浸料,按照设计的铺层根据热压罐固化工艺制成嵌入HNBR阻尼薄膜的共固化高阻尼复合材料试件,模态试验和层间剪切试验验证了该工艺和黏弹性材料组分的有效性,其层间结合力最高可达9.4 MPa,其一阶模态损耗因子可达3.92%。

A new kind of HNBR viscoelastic damping material ingredient which can co-cure with fiber-glass/ epoxy resin prepreg is investigated. After the viscoelastic damping material is dissolved in tetrahydrofuran dissolvant to form viscoelastic material solution, the double-side brush coating process is developed to make the solution into damping membrane on fiber-glass/ epoxy resin prepreg. The fiber/ epoxy resin composite preperg with damping film is laid according to the design requirement, and then the embedded low-temperature co-curing high damping composite specimens are manufactured on the basis of the autoclave process curve. The modal parameters and interlaminar bonding force between the damping layer and composite are tested to verify the validity of the processing technology and viscoelastic damping material ingredient presented in this paper, the maximum binding capacity of the layer is up to 9.4MPa,the first order modal loss factor is up to3.92%.