摘要
Al/Cu复合材料具有质轻、导电良好和成本低等优点,成为了近年来研究的热点。介绍了Al/Cu复合材料的主要界面复合理论,并着重阐述了近年来对主流理论的研究。综述了国内外关于Al/Cu复合材料的制备工艺和数值模拟的研究进展,指出了各工艺的优缺点,并对制备工艺的改进方向、未来数值模拟的研究方向进行了展望。
Al/Cu composites with excellent performances, such as light weight, great electrical conductivity and low price, have been a research hotspot in recent years. Theories on surface composite of Al/Cu composites, and studies of the mainstream theory are introduced. Preparation methods and numerical simulation studies of Al/Cu composite are reviewed, and advantages and disadvantages of each method are also described. Finally, the preparation improvement direction of Al/Cu composites and future research direction of numerical simulation are predicted.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2016年第7期148-153,共6页
Materials Reports
基金
国家"973"计划项目(2012CB722803)
教育部"创新团队发展计划"(IRT1250)