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Fe对Sn0.7Cu无铅钎料显微组织和力学性能的影响 被引量:5

Effect of Fe on Microstructure and Mechanical Properties of Sn0.7Cu Solder
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摘要 研究了Fe颗粒对Sn0.7Cu无铅钎料显微组织、润湿性能和拉伸性能的影响规律。结果表明:适量Fe颗粒的加入可以细化钎料基体组织,β-Sn基体中的Cu6Sn5由原先的针状过渡为点状;在Sn0.7Cu-0.05Fe中,钎料的润湿角最小,获得了较好的润湿性能;当Fe添加过量时,润湿性能受到一定程度恶化,且表面较粗糙,出现明显的氧化现象;抗拉强度随Fe含量的增加呈现先上升后下降的趋势,Sn0.7Cu-0.05Fe获得了最大抗拉强度,Fe的最佳添加量为0.05 wt%。 The effects of Fe on the microstructure, wettability and tensile property of Sn0.7Cu solder were investigated. The results show that the microstructure is refined and the morphology of Cu6Sn5 transforms from needle-shaped into dot-shaped with the appropriate addition of Fe. The smallest wetting angle can be obtained in Sn0.7Cu-0.05Fe solder. When Fe content increases to some content, the wettability is deteriorated and the obvious oxidation phenomenon appears. The ultimate tensile strength increases firstly and then decreases with the increase of Fe content. The hightest tensile strength is obtained in Sn0.7Cu-0.05Fe solder, and the best addition of Fe content is 0.05 wt%.
出处 《热加工工艺》 CSCD 北大核心 2016年第3期205-206,210,共3页 Hot Working Technology
基金 江苏省科技厅项目(BK20141228) 苏州市科技厅项目(SYG201421) 常熟理工学院机械工程学院重点项目(JXK2014003 JXJ2014003)
关键词 Sn0.7Cu-xFe钎料 显微组织 润湿性能 拉伸性能 Sn0.7Cu-xFe solder microstructure wettability tensile property
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