粘片胶固化对塑封集成电路可靠性的影响

The Effect of Epoxy on the Reliability of Plastic Integrated Circuit

当具有诸如分层等可靠性缺陷的微电子器件焊接在线路板上,通过回流焊时会产生塑封体裂缝、塑封体鼓胀等重要缺陷。粘片胶未充分固化、水汽未完全排除、环境湿气较大易吸湿等原因导致水汽沿着塑封体与引线引脚向内部扩散。表现为各结合面的分层,粘片胶与芯片之间、塑封体与引线之间、塑封体与芯片之间,各种分层在快速加热产生的热应力下水汽快速膨胀,从而引起器件可靠性隐患。

Because of the plastic packaging process, the chip should always and molding compound adhesive binding,there is the reliability problems can not be overcome. Such as chip layer, adhesive layer and so on. Many studies have no longer discuss stratified, chip, here mainly analyzes the influence of adhesive layer on the reliability of products. Due to the high temperature adhesive curing time is not enough, not the vapor temperature adhesive in a completely discharged, the product is heated, the water vapor in high temperature adhesive in the rapid expansion, cause abdominal burst, product reliability can not be through.