摘要
电子电路曲面结构对于实现结构功能一体化有重要应用意义。针对LTCC多层电路基板,提出了一种曲面结构基板的加工制造方法。介绍其制造中曲面结构导体制作、曲面结构成形、曲面结构烧结等环节的关键制造工艺。通过X光和剖切方式对所制造的曲面基板进行测试分析,结果证实曲面基板中的多层布线均连通,且层间对位精度优于15μm。提出的曲面LTCC基板制造技术能够满足后续产品的研制加工要求,对于曲面电子技术和LTCC技术的发展都具有借鉴意义。
The curved substrate of electric circuit is meaning for structure-function integration application. In the paper,the fabrication technology for LTCC curved substrate is proposed, including the wiring in the multilayer LTCC curved substrate, the molding and the co-firing of the curved structure. By using the X-Ray, the section of the LTCC curved substrate is tested, confirming that, the routing of the multilayer in LTCC keeps connected while the registration precision exceeds 15 μm. The fabrication technology proposed in this paper can satisfy the requirements, which can be used for reference to curved electronic applications.
出处
《电子与封装》
2016年第5期39-42,47,共5页
Electronics & Packaging
基金
国家自然科学基金(61404119)
关键词
低温共烧陶瓷
曲面基板
制造
low-temperature co-fired ceramic（LTCC）
curved substrate
fabrication
