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LD-144改性氮化铝/环氧树脂新型电子封装材料的性能研究 被引量:6

Study on LD-144 modified aluminum nitride/epoxy resin thermal conductive composite
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摘要 采用钛酸酯偶联剂LD-144对AlN粉末进行表面改性,通过机械搅拌,超声波处理制备AlN/环氧树脂(EP)新型高导热电子封装材料。研究不同钛酸酯偶联剂含量及AlN粉末含量对复合材料的导热性能、热膨胀系数以及介电性能等的影响。结果表明:偶联剂对AlN粉末的改性有利于其与基体EP的界面结合,且随着填料AlN含量的增加,复合材料的导热性能提升明显,热膨胀系数有一定程度的下降。 Aluminum nitride powder was modified by titanate coupling agent LD-144,and a series of epoxy resin composites containing the modified AlN were prepared by the mechanical mixing and ultrasonic treatment.The effect of volume fraction of coupling agent and AlN on the thermal conductivity,thermal expansion coefficient and dielectric properties of these composites was investigated.Results showed that the modification of AlN powder by coupling agent was conducive to the interface bonding of epoxy resin matrix within the packing and the addition of AlN powder can improve thermal conductivity of the composites effectively,thermal expansion coefficient had a certain degree of decline meanwhile.
出处 《化工新型材料》 CAS CSCD 北大核心 2016年第5期40-42,共3页 New Chemical Materials
关键词 钛酸酯偶联剂 ALN 环氧塑封料 导热系数 热膨胀系数 titanate nitride coupling agent AlN epoxy molding compound thermal conductivity coefficient thermal expansion coefficient
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