室温固化低密度环氧填充料的制备

Preparation of low density epoxy syntactic with room temperature curing

以木粉及空心玻璃微球(H G M)为填料,制备了室温固化低密度环氧填充料。通过力学性能、物理性能等测试,研究了填充料性能。制备的填充料具有良好的性能,固化后密度为0.69g/cm^3,抗压强度59.4 M Pa,拉伸剪切强度19.5M Pa。

An low density epoxy syntactic with room temperature curing was prepared by wood flour and hollow glass microspheres. Its properties of mechanical properties and physical properties were studied. The epoxy syntactic shows good performance, its cured is 0.69 g/cm3 density, compressive strength of 59.4 MPa and shear strength of 19.5 MPa.