电子级乙烯基MQ硅树脂的制备及应用

Preparation and Application of Electronic Vinyl MQ Silicone Resin

以正硅酸乙酯、四甲基二乙烯基二硅氧烷和六甲基二硅氧烷为原料,盐酸为催化剂制备了乙烯基MQ硅树脂,经水洗除去氯离子。以此为原料与乙烯基硅油、含氢硅油、白炭黑经复配制备加成型电子硅橡胶。结果表明,制备出的MQ硅树脂经过5次水洗后,Cl-含量<0.5 mg/L;所得硅橡胶的初始硫化温度为73.4℃,118.3℃固化完全。硫化后硅橡胶电阻率>1.0×1016Ω·cm,电气强度为20 k V/mm,介质电常数为3.02,介质损耗因数为7.17×10-4;硅橡胶应用于电子芯片封装,其合格率为98%。

The vinyl MQ silicone resin was synthesized by tetraetlioxysilane,divinyl tetrametliyl disiloxaneand hexametliyldisiloxane as the raw materials,and hydrochloric acid as the catalysts. The silicone was water-washed in order to remove the chloride ion. The addition-type electronic the semiconductor industry was prepared by vinyl MQ silicone,vinyl silicone oil,hydrogen-containing siliconeoil and fumed silica. Results show that Cl is less than 0. 5 mg/L after 5 washing cycles. The electronic siliconerubber cures at 73. 4 ℃ ,and completely cures at 118. 3 ℃ . The resistivity of t!ie cured silicone rubber ismore than 1. 0 × 10^16Ω.c m ,and the breakdown strength,dielectric constant,loss factor are 20. 4 W /mm,3. 0 2,and 7. 17 × 1 0 ^-4,respectively. The qualification rate of thie electronic chips encapsulated withi the preparingsilicone rubber is 9 8 % .