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基于平行微隙焊的薄膜传感器和外引线的互连工艺

Interconnect Techniques between Thin-Film Sensors and Leads Using Parallel Micro Gap Welding
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摘要 采用平行微隙焊的方法,成功实现了5μm厚的Ni Cr合金薄膜与直径为0.15 mm的Ni引线焊接,可用于薄膜传感器外引线的互连。试验结果表明:采用大电流(100~60 A),短时间(0.5~2 ms)的规范,能够得到较好的焊接接头。并讨论了电极压力对焊接接头的影响,提出在焊接时应采用合适的电极压力。 The Ni Cr thin-films(5 mm thick) and Ni leads with 5 mm-diameters were successfully bonded using a parallel micro gap welding method for thin-film sensor interconnects. According to our experimental results, welding joints between the Ni Cr thin-films and Ni leads were achieved with strong currents(100~60 A) and short duration(0.5~2 ms). The tensile force is high enough. Effects of the electrode force on the welding quality were investigated. It is necessary to choose appropriate electrode forces during welding process.
出处 《电子工艺技术》 2016年第3期125-127,134,共4页 Electronics Process Technology
基金 国家自然科学基金项目(项目编号:51505106)
关键词 薄膜传感器 平行微隙焊 电极压力 thin-film sensor parallel micro gap welding electrode force
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参考文献7

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