采用石墨烯层的电路芯片的热效应研究

Thermal Characteristics for Circuit Chips with Graphene Layer

随着电路集成度的不断提高,电路的热效应已成为影响电路可靠性的一个重要因素。对采用单层石墨烯的电路芯片的热效应进行了研究,仿真结果说明,在电路芯片中增加一层石墨烯,有利于热传导,可以降低芯片的峰值温度,而且使得温度分布均匀。

With the increase of the high circuit integration density, the thermal characteristics have become an important factor that can affect the reliability of circuit chips. The thermal characteristics of circuit chips with single layer grapheme are investigated, the simulation results show that the grapheme layer in the circuit chip is beneficial to thermal transfer, the maximal temperature of circuit chip can be reduced, the uniform surface temperature distribution can be obtained.