复合还原法PCB化学镀铜研究

The Study of PCB Electro-less Copper Plating Technology by the Mixed Reduction

本文主要研究了复合还原法对PCB化学镀铜的影响。通过试验结果分析了不同还原环境变化下对化学镀铜过沉铜速度和镀层质量的影响和规律,在最佳工艺条件下获得了沉积速度快、镀层均匀,性能优异的镀层,对绿色PCB制备工艺和深入研究具有重要的参考意义。

The mixed reduction process on the effect of electro-less copper plating technology in the PCB manufactorysystem was researched in the paper. Through this experiment, the impact of the changes of the main reduction environmenton plating rate and deposits quality were studied, the law of the impact of the various factors come to the platingrate and deposits quality was obtained, and the process parameters were optimized. Then the high quality copperdeposits with high plating rate were got. This study has a guiding role on the green industrial production of PCB.