微米铜丝的低温力学性能测试

Low Temperature Mechanical Performance Test of Micron Copper Wire

针对纤维材料变温环境力学性能测试的需要,在华中科技大学研制的纤维材料试验机的基础上引入了温控装置,从而实现纤维材料在高低温环境下的力学性能测试。采用该装置对不同直径微米铜丝在不同温度、不同拉伸速率条件下的力学性能开展实验研究,测试结果表明弹性模量和抗拉强度随温度的降低而线性增加,屈服强度的变化不太明显。另外,低温环境下微米铜丝的力学性能表现出与其直径相关的尺度效应,而这一现象在常温下一直没有观测到。最后,还研究了拉伸速率对微米铜丝的力学性能影响,结果表明,在现有装置的许用范围之内,拉伸速率对其力学性能的影响不大。

For mechanical property test of fiber material in a temperature variable environment, a temperature control device was introduced to the fiber material testing machine developed by Huazhong University of Science and Technology to realize fiber material mechanical property test in a temperature variable environment. Using this device, experimental study of mechanical property was carried out for micron copper wire with different diameters at different temperatures and under different stretching rates condition. Test results show that both elastic modulus and tensile strength increase linearly with the decrease of temperature, the change of yield strength is not obvious. In addition, in low temperature environment, micron copper wire presents scale effect related with its diameter, which is not observed before at room temperature. Finally, the influence of stretching rate on micron copper mechanical properties was also studied. Results show that in the allowable range of existing device, the effect of tensile rate on its mechanical properties is not obvious.