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饵激光预备及光固化灯超强功率模式对树脂微渗漏的影响 被引量:4

The effect of Er: YAG laser preparation and xtra power mode of curing light on the microleakage of the composite resin
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摘要 目的研究饵激光备洞和光固化灯超强功率模式对树脂充填微渗漏的影响。方法将40颗离体后牙随机平均分成4组进行备洞和充填固化。A组:高速涡轮机加安福士椅旁LED灯(550 m W/cm2,20 s);B组:高速涡轮机加VALO光固化灯(超强功率模式3 200 m W/cm2,3 s);C组:铒激光加安福士椅旁LED灯;D组:铒激光加VALO光固化灯。所有样本制备V类洞并行树脂充填后置于37℃生理盐水中24 h,冷热循环后亚甲基蓝溶液染色,在低速切割机下颊舌向切开,体式显微镜下观察剖面微渗漏情况,计分,统计。结果所有样本的龈壁微渗漏与牙合壁相比较更高,A组微渗漏程度较B、C组低,有统计学差异(P<0.05)。D组微渗漏最大,与其他各组有统计学差异(P<0.05)。结论铒激光备洞和光固化灯超级功率模式都会增加树脂充填微渗漏的发生。 Objective To study the effect of Er: YAG laser preparation and xtra power mode of curing light on the microleakage of the composite resin filling. Methods 40 extracted molars were randomly divided into 4 groups for cavity preparation,filling and curing: Group A—High speed handpiece and ANTHOS therapy unit attached LED light( 550 m W / cm^2,20 s); Group B—high speed handpiece and VALO light curing unit( xtra power mode 3 200 m W / cm^2,3 s); Group C—Er: YAG laser and ANTHOS therapy unit attached LED light; Group D—Er: YAG laser and VALO light curing unit. All the samples were prepared for class V cavities thereupon resin filling and placed in the normal saline at 37 ℃ for 24 h. After thermocycling,all samples were stained by methylene blue solution,and then sectioned longitudinally in buccolingual direction. Microleakage of the composite resin was observed under stereomicroscope and statistically analyzed. Results Microleakage of gingival wall in all samples was higher than that of the occlusal wall;Microleakage of group A was lower than in group B and group C,with a statistically significant difference( P〈0. 05). Group D had the largest microleakage compared with other groups,and the difference was statistically significant( P〈0. 05). Conclusion The Er:YAG laser preparation and xtra power mode of the light curing unit will increase the risk of the resin filling leakage.
作者 罗瑞 陈亚明
出处 《口腔医学》 CAS 2016年第5期403-406,共4页 Stomatology
基金 江苏高校优势学科建设工程资助项目(2014-37)
关键词 铒激光 超强功率模式 树脂 微渗漏 Er:YAG laser xtra power mode resin microleakage
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