双氧水体系抛光液中7003铝合金的化学机械抛光

Chemical mechanical polishing of 7003 aluminum alloy in hydrogen peroxide system polishing slurry

在碱性抛光液条件下,研究了过氧化氢抛光液体系下7003铝合金化学机械抛光行为。采用电化学分析方法分析了过氧化氢和十二烷基硫酸钠的协同作用机制,利用原子力显微镜观察抛光后的表面微观形貌。结果表明,低浓度H_2O_2能够加速铝合金表面氧化速度,促进材料的去除,同时能够减轻抛光后的表面橘皮缺陷;较高浓度H_2O_2能够在铝合金表面生成致密氧化膜,降低抛光速率。阴离子表面活性剂SDS能够通过吸附成膜减缓铝合金在H_2O_2介质下的腐蚀速率,当SDS的含量为1%时,缓蚀率达到88.56%,有效降低了抛光后的表面腐蚀,通过AFM检测抛光后的表面粗糙度降至13.9nm。

Chemical mechanical polishing （CMP） of 7003 aluminum alloy with hydrogen peroxide in alkaline slurry was investigated. The synergy effect ofH2O2 and SDS on the material removal in CMP was analyzed by using electrochemical dynamics. Atomic force microscopy （AFM） was applied to charac-terize the aluminum alloy surface before and after polishing. It was found that low concentration H2O2 can accelerate the oxidation rate in aluminum alloysurface and promote the removal rate in a polishing process, at the same time can reduce the orange peel defect after polishing. Additionally, polishingrate was reduced in high concentration H2O2 because of dense oxidation film generated in aluminum alloy surface. The electrochemical dynamics analysisshows that the anionic surfactant SDS can reduce the corrosion rate by the adsorbed film under H2O2 slurry. When SDS content reaches to 1%, better in-hibition efficiency can achieved with the inhibition rate of 88.56% and surface roughness of 13.9nm after polishing.