往复运动Y形密封圈温度场的结构优化

Reciprocation Y-Ring Structure Optimization of Thermal Field

通过使用ANSYS软件对往复运动Y形密封圈的温度场进行仿真研究,通过对Y形密封圈增加散热孔而改善密封圈的温度场分布,对Y形密封圈结构进行了优化和受力分析,对优化后的Y形密封圈做了相应的结构应力学分析,降低了密封圈最高温度。比较了不同散热孔径的大小对密封圈等效应力的影响,分析了温度场对密封圈密封性能和使用寿命的影响,得到了优化后的Y形密封圈的温度场分布,保证了密封圈的密封性能并且密封圈温度场得到改善,达到了降低温升的效果。

Simulation study is carried out of the temperature field of the Y-shaped sealing ring with ANSYS software,the temperature field distribution of the sealing ring is improved by adding the cooling hole of the Y shaped sealing ring,the Y-shaped sealing ring structure is optimized and carried out force analysis,using structural stress to analyze the optimized Y-shaped sealing ring,reducing the maximum temperature of the sealing ring.Compares the size of the different diameter heat to seal which influences the equivalent stress of the sealing ring,and analyzes the temperature field influence on sealing ring sealing performance and service life.The temperature distribution of the Y-shaped sealing ring is obtained,which can ensure the sealing performance of the sealing ring and the temperature field of the sealing ring is improvea.