摘要
采用浸渍法以缓蚀剂氨基三亚甲基膦酸(ATMP)为原料、添加剂烷基酚聚氧乙烯醚(APEO)和卤素钾盐的水溶液为封孔剂溶液在镍钯金电路板(PCB-ENEPIG)表面自组装形成有机皮膜。通过电化学阻抗谱(EIS)、扫描电镜研究了该有机保护膜的耐腐蚀性能及其形貌。实验结果表明:有机自组装膜对PCB-ENEPIG有较好的耐蚀作用,采用1.5 g/L ATMP、10 g/LAPEO、1 g/L碘化钾得到的自组装膜耐腐蚀性能最佳。
A self assembly film on Ni, Pd, and Au printed circuit board （PCB-ENEPIG） surface was achieved by impregnating using amino trimethylene phosphonic acid （ATMP） as the raw material, a mixture of alkylphenol ethoxylates （APEO） and halogen salt in deionized water as solvent. Electrochemical impedance spectroscopy and scanning electron microscope were used to study the corrosion inhibition performance and morphology of self assemble film. The experimental results indicated that self-assembly film had a better corrosion inhibition effect on the PCB-ENEPIG while a highhas best corrosion resistance performance recipe including 1.5 g/L ATMP, 10 g/LAPEO, and 1 g/L KI.
出处
《精细化工中间体》
CAS
2016年第2期58-61,共4页
Fine Chemical Intermediates
基金
湖南省战略性新兴产业科技攻关与重大成果转化项目(2015GK1046)
长沙市科技计划项目(K1508003-11)资助
关键词
PCB—ENEPIG
ATMP2
自组装膜
缓蚀
PCB-ENEPIG
ATMP2
self-assembly film
corrosion of the film was achieved using the
