摘要
目的介绍纳米铜在食品抗菌包装材料中的研究现状。方法总结纳米铜食品抗菌包装材料在制备、应用、迁移及安全方面的研究进展,探讨纳米铜抗菌包装材料未来的研究方向。结论纳米铜的尺寸、形貌、化学组成、分散性、添加量等都会对复合包装材料的力学性能、光学性能、热力学性能等产生影响。纳米铜的加入同时会使复合材料具有抗菌性。纳米铜向食品中的迁移可能会影响食品安全,但目前对纳米铜迁移规律和安全评价的研究不足,需要深入系统地探讨。
The work aims to introduce the progress of nano-copper in food antimicrobial composite packaging material.The development of nano-copper composite packaging material was summarized in fabrication,application,migration and safety,and the future development direction was discussed.The size,morphology,disperse uniformity,chemical constitution and concentration of the nano-copper can affect mechanical,optical,thermodynamic properties of the composite material.Besides,the addition of nano-copper can also endow the composite with antibacterial capability.The migration of nano-copper from the material to the food can be a risk for the food safety.However,the research on the law of migration and the safety assessment is insufficient.Therefore,the deeper researches need to be made in the future.
作者
王琦
卢珊
胡长鹰
WANG Qi;LU Shan;HU Chang-ying(Packaging Engineering Institute,Jinan University,Zhuhai 519070,China;Department of Food Science and Engineering,Jinan University,Guangzhou 510632,China)
出处
《包装工程》
CAS
北大核心
2019年第5期64-71,共8页
Packaging Engineering
基金
国家自然科学基金(31571762)
国家重点研发计划(2018YFC1603200
2018YFC1603205)
关键词
纳米铜
食品抗菌包装
迁移
安全
nano-copper
food antimicrobial packaging
migration
safety
