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PP/废PCB粉共混体系的动态力学性能分析 被引量:2

Analysis of Dynamic Mechanical Properties of Polypropylene/Waste PCB Powder Blends
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摘要 采用熔融共混法制备了聚丙烯(PP)/废印刷电路板非金属粉(废PCB粉)共混体系,利用动态力学性能分析法(DMA)研究了废PCB粉含量、改性剂聚丙烯接枝马来酸酐(PP-g-MAH)及振动频率对共混体系动态力学性能的影响。实验结果显示:PP/废PCB粉共混体系的储能模量和损耗模量较纯PP均有所增大,且随废PCB粉含量的增加进而增大,力学损耗因子峰值和玻璃化转变温度则有所下降;相容剂PP-g-MAH的加入使废PCB粉和PP之间形成较牢固的界面层,使共混体系储能模量较改性前进一步增加,而损耗模量和力学损耗因子峰值较改性前有所减小;振动频率对共混体系的动态力学性能亦有一定影响,随振动频率的增加,共混体系的储能模量提高,损耗模量和力学损耗因子峰值则有所减小。 Polypropylene (PP)/waste printed circuit boards nonmetallic powder(waste PCB power) blends was prepared by melt blending method. The effects of content of waste PCB power, PP-g- MAH and vibration frequency on dynamic mechanical properties of PP/waste PCB powder blends were investigated by dynamic mechanical analysis (DMA). The results demonstrate that the storage modulus and loss modulus of blends increase with increasing content of waste PCB power, mechanical loss factor and glass transition temperature decreases slightly. The Compatible agent PP-g-MAH is added to make the waste PCB powders between PP and form a solid interface layer, the storage modulus is further increased than that of non-modified ones, the loss modulus and mechanical loss factor decreases. The dynamic mechanical properties of the blend system are also affected by the vibration frequency. The storage modulus of the blend system increases with the increase of the vibration frequency, and the loss modulus and mechanical loss factor decrease.
出处 《塑料科技》 CAS 北大核心 2016年第6期32-35,共4页 Plastics Science and Technology
基金 常州工程职业技术学院科研重点项目(KJ14303)
关键词 废印刷电路板非金属粉 聚丙烯 共混体系 动态力学性能 Waste PCB power Polypropylene Blends Dynamic mechanical properties
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参考文献15

  • 1Guo J,Rao Q L,Xu Z M.Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound[J].Journal of Hazardous Materials,2008,158:728-734.
  • 2Huang K,Guo J,Xu Z M.Recycling of waste printed circuit boards:A review of current technologies and treatment status in China[J].Journal of Hazardous Materials,2009,164(2-3):399-408.
  • 3刘勇,陈学娟,陈少纯.废弃线路板中非金属材料热解法资源化利用的研究进展[J].中国资源综合利用,2009,27(3):11-14. 被引量:17
  • 4Chancerel P,Rotter S.Recycling-oriented characterization of small waste electrical and electronic equipment[J].Waste Management,2009,29(8):2 336-2 352.
  • 5李启胜.废旧线路板中塑料的回收及利用[J].工程塑料应用,2012,40(2):97-100. 被引量:4
  • 6Eswaraiah C,Kavitha T,Vidyasagar S,et al.Classification of metals and plastics from printed circuit boards(PCB)using air classifier[J].Chemical Engineering and Processing,2008,47(4):565-576.
  • 7王雁冰,黄志雄,张联盟.DMA在高分子材料研究中的应用[J].国外建材科技,2004,25(2):25-27. 被引量:61
  • 8Manchado M L,Arroyo M.Thermal and dynamic mechanical properties of polypropylene and short organic fiber composites[J].Polyer,2000,41(21):7 761-7 767.
  • 9Gloaguen M,Lefebvre J M.Plastic deformation behaviour of thermoplastic/clay nanocomposites[J].Polymer,2001,42(13):5 841-5 847.
  • 10郭云霞,胡国胜,李迎春,杨云峰,王志强.尼龙11/POE共混物的形态与力学性能[J].高分子材料科学与工程,2012,28(8):43-46. 被引量:4

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