期刊文献+

A comparative analysis of reticular crack on ceramic plate driven by thermal shock

A comparative analysis of reticular crack on ceramic plate driven by thermal shock
原文传递
导出
摘要 Reticular crack is generally found on the surface of ceramic material that has been subjected to a thermal-shock condition. In the present study, a quantitative effect of thermal shock and quench temperature has been studied and investigated. Experimental tests were carried out to characterize the reticular crack that has been found in the Ge Kiln, which is a famous art of the ancient Chinese culture. After comparative analysis between thermal-shock cracks and the glaze crack patterns of the Ge Kiln porcelain,it is found that this study is expected to provide a powerful tool for recurrence of the long-lost firing and cooling process of the Ge Kiln porcelain. Reticular crack is generally found on the surface of ceramic material that has been subjected to a thermal-shock condition. In the present study, a quantitative effect of thermal shock and quench temperature has been studied and investigated. Experimental tests were carried out to characterize the reticular crack that has been found in the Ge Kiln, which is a famous art of the ancient Chinese culture. After comparative analysis between thermal-shock cracks and the glaze crack patterns of the Ge Kiln porcelain, it is found that this study is expected to provide a powerful tool for recurrence of the long-lost firing and cooling process of the Ge Kiln porcelain.
出处 《Science China(Physics,Mechanics & Astronomy)》 SCIE EI CAS CSCD 2016年第7期46-51,共6页 中国科学:物理学、力学、天文学(英文版)
基金 supported by the National Natural Science Foundation of China(Grant No.11272313)
关键词 reticular crack thermal shock CERAMICS Ge Kiln porcelain 网状裂纹 热冲击 陶瓷板 驱动 陶瓷材料 冲击条件 淬火温度 实验测试
  • 相关文献

参考文献16

  • 1R. Danzer, T. Lube, R Supancic and R. Damani, Adv. Eng. Mater. 10, 275 (2008).
  • 2B. Wang, and J. Han, Sci. China-Phys. Mech. Astron. 55, 493 (2012).
  • 3W. D. Kingery, J. Am. Ceram. Soc. 38, 3 (1955).
  • 4A. Gardel, C. Proisy, S. Lesourd, S. Philippe, J. Caillaud, S. Gonthar- et, E. J. Anthony, and L. Brutier, J. Coast. Res. 25, 424 (2009).
  • 5K. Bakos, A. Dombi, F. Jarai-Szabn, and Z. Neda, AlP Conf. Proc. 1564, 205 (2013).
  • 6S. Nag, S. Sinha, S. Sadhukhan, T. Dutta, and S. Tarafdar, J. Phys. Condens. Matter. 22, 015402 (2010).
  • 7T. Ishii, and M. Matsushita, J. Phys. Soc. Jpn. 61, 3474 (1992).
  • 8J. Li, A. K. Dozier, Y. Li, F. Yang, and Y. T. Cheng, J. Electrochem. Soc. 158, A689 (2011).
  • 9S. Kumar, and A. C. F. Cocks, J. Mech. Phys. Solids. 60, 723 (2012).
  • 10S. B. Weber, T. Grande, G. W. Scherer, and M. A. Einarsrud, J. Am. Ceram. Soc. 96, 420 (2013).

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部