摘要
介绍日本的2015年度版印制电路板技术路线图,第三部分是IC封装载板。IC封装载板有带式结构、刚性结构、积层结构、陶瓷结构和玻璃结构等多种种类,还包括内插板。
This article introduces the printed circuit board technology roadmap of Japan's 2015 annual edition. The third part is the IC packaging substrates, which includes tape structure substrate, rigid structure substrate, buildup structure substrate, and other types and Interposer.
出处
《印制电路信息》
2016年第6期5-13,共9页
Printed Circuit Information