摘要
文章介绍印制电路板在电镀过程中,因种种原因导致电镀铜层异常,从而引发后制程OSP不上膜或其它品质问题的发生。给予印制电路板制造厂商参考,从而引起重视,预防电镀品质隐患及问题的发生。
In this paper, the copper plating process is introduced. Caused by various reasons, the occurrence of OSP not on fi lm or other quality problems will happen. The paper gives reference to the printed circuit board manufacturer, and hopes to pay attention to prevent the occurrence of electroplating quality risks and problems.
出处
《印制电路信息》
2016年第6期38-42,共5页
Printed Circuit Information
