电镀铜丝形成探讨

Plating copper whisker forming mechanism and study

从电镀铜反应原理上分析电镀铜丝形成可能影响因素,对产生电镀铜丝的影响因素进行模拟实验,层析各因素对铜丝形成的影响,为改善电镀铜丝提供思路和方向。

We have done analysis of factors that may affect the formation of copper whisker based on plating reaction possibility and simulating the formation of copper whisker in lab. This paper makes research on each infl uence factor on this defect and provides ideas and direction to improve the copper whisker.