期刊文献+

High Resolution Medium Energy ion Scattering Analysis for Investigating UltraShallow Junction of Antimony Implanted in Conventional Silicon

High Resolution Medium Energy ion Scattering Analysis for Investigating UltraShallow Junction of Antimony Implanted in Conventional Silicon
下载PDF
导出
出处 《材料科学与工程(中英文A版)》 2016年第1期17-22,共6页 Journal of Materials Science and Engineering A
关键词 离子散射 硅晶片 超浅结 植入 能量离子 高分辨率 互补金属氧化物半导体 Antimony doped Si, ion implantation, rutherford backscattering spectroscopy (RBS), medium energy ion scattering(MEIS), rapid thermal annealing (RTA), shallow junction formation.
  • 相关文献

参考文献11

  • 1International Technology Roadmap for Semiconductors. 2009. "ITRS. Roadmap Report." http://www.itrs.net.
  • 2Vandervorst, W. 2007. "USJ Metrology: from 0D to 3D Analysis." International Conference on Frontiers of Characterization and Metrology for Nanoelectronocs. AIP Conf. Proc. 931 (1): 233.
  • 3Alzanki, T., Gwilliam, R., Emerson, N., Tabatabaian, Z., Jeynes, C. and Sealy, B. J. 2004. "Concentration Profiles on Antimony Doped Shallow Layers in Silicon." SemL Sci.& Technol. 19: 728.
  • 4Reading, M. A., Van der Berg, J. A., Zalm, P. C., Armour D. G., Baily, P. and Noakes, T. C. Q. et al. 2010. "High Resolution Medium Energy Ion Scattering Analysis for the Quantitative Depth Profile for Ultrathin High-k Layer." J. Vac. Sci. Technol. B 28 (1):C1-C65.
  • 5Afrosimov, V. V., Dideykin, A. T., Skharon, V. I., Serenkov, I. T. and Vul, S. P. 2014. "Utilizing of Medium Energy Ion Scattering Spectroscopy for the Composition Investigation of Grapheme Oxide Films on Silicon Surface," Nanosystems." Phys. Chem. Math. 5 (1): 113-6.
  • 6Sortica, M. A., Grand, P. L., Machado, G. and Miotti, L. 2009. "Characterization of Nanoparticles through Medium Energy Ion Scattering." J. Appl. Phys. 106: 114320.
  • 7Jeynes, C., Barradas, N. B., Marriott, P. K., Boudreault, G., Jenken, M. and Wendler E. 2003. "Elemental Thin Film Depth Profile by Ion Beam Analysis Using Simulated Annealing - A New Tool." J. Phys. D: Appl. Phys. 36 (7): R97-R126.
  • 8Sealy, B. J., Smith, A..J., Alzank, T., Bennett, N., Li, L.and Jeynes, C. et al. 2006. "Shallow Junction in Silicon with Low Thermal Budget Processing." In IEEE Proceedings of the 6th International Workshop on Junction Technology, 10-5.
  • 9Van den Berg, J. A., Armour, D. G., Zhang, S., Whelan, S., Ohnos, H. and Wang, T. S. et al. 2002. "Characterization by Medium Energy Ion Scattering of Damage and Dopant Profiles Produced by Ultrashallow B and as Implants into Si at Different Temperature." J. Vac.Sci. Technol. B 20 (3): 974.
  • 10Pichier, P. 2004. "Intrinsic Point Defects, Impurities and Their Diffusion in Silicon." Birkhauser: Springer, New York.

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部