深圳市某五金电子加工厂职业病危害因素识别与关键控制点分析

Identification of occupational hazards and analysis of critical control points in a hardware electronic processing enterprise of Shenzhen City

目的探讨深圳市某五金电子加工厂的主要职业病危害因素,确定关键控制点,为企业职业病危害防护提供依据。方法采用现场职业卫生学调查、工作场所职业病危害因素检测等方法进行分析。结果该加工厂主要职业病危害因素为噪声、高温、粉尘、激光辐射、紫外辐射和化学毒物。各种职业病危害因素检测结果分别为工作场所噪声强度78.2~95.2 dB(A),超标率38.1%;个体噪声强度80.1~93.5 dB(A),超标率50.0%;矽尘浓度(总尘)(C_(TWA))6.6~6.9 mg/m^3,矽尘浓度(呼尘)(C_(TWA))1.6~1.8 mg/m^3,超标率100%;作业场所生产性热源的湿球黑球温度(WBGT)指数、激光辐射、紫外辐射、其他粉尘、砂轮磨尘、电焊烟尘和化学毒物强度(浓度)检测结果均低于职业接触限值。结论噪声、矽尘、化学毒物(甲醇、甲苯、正己烷)是该五金电子加工厂主要的控制因素,冲床、抛光喷砂、包装清洁、喷漆是关键控制工位。

[Objective] To explore the main occupational hazard factors in a hardware electronic processing enterprise of Shenzhen City,identify the critical control points,and provide the basis for protection of occupational hazards in the enterprise.[Methods]The methods of field hygiene investigation and occupational hazard factors detcetion were applied in the analysis.[Results]The main occupational hazard factors in the enterprise were noise,high temperature,dust,laser radiation,ultraviolet radiation and chemical poisons. The detection results of the main occupational hazard factors showed that the noise intensities of workplace were 78.2-95.2 dB（A）with the exceeding standard rate of 38.1%,the individual noise intensities were 80.1-93.5 dB（A）with the exceeding standard rate of 50.0%,CTWA of silica dust（total dust）were 6.6-6.9 mg/m^3,and CTWAof silica dust（respiratory dust） were 1.6-1.8 mg/m^3 with the exceeding standard rate of 100%. The intensities（concentrations） of wet black globe thermometer index（WBGT） of productive heat source,laser radiation,ultraviolet radiation,other dust,grinding wheel dust,welding fume and chemical poisons all met the occupational exposure limits.[Conclusion]Noise,silica dust and chemical poisons（methanol,toluene and hexane）are the critical control points of the hardware electronic processing enterprise,while the punching machine,polishing and sand blasting,packing cleaning,and spray paint are the critical control posts.