摘要
采用等离子喷涂技术在Cu基体表面制备了Ag/Sn O2涂层,并研究了真空退火对涂层组织和性能的影响。结果表明:在退火过程中,Ag/Sn O2涂层内部银基体再结晶和晶粒长大过程持续进行,Sn O2颗粒在银基体中也进行了重新分布;800℃退火时涂层与基体出现了冶金结合的现象。随着退火温度的提高,Ag/Sn O2涂层硬度显著降低,而涂层电导率的变化趋势与硬度相反。
Ag/SnO2 coatings on Cu substrate were prepared by atmospheric plasma spraying, and effects of vacuum annealing on microstructure and properties of the coatings were investigated. The results show that during annealing, the recrystallization and grain growth of silver matrix in the coating continues, and SnO2 particles redistribute. Annealed at 800 ℃, the coating bonds metallurgically with the matrix. With increasing of annealing temperature, the hardness of Ag/SnO2 coating decreases significantly, while the electric conductivity of coating has the opposite trend to hardness.
出处
《金属热处理》
CAS
CSCD
北大核心
2016年第6期128-130,共3页
Heat Treatment of Metals
基金
国家自然科学基金(51401145)
陕西省自然科学基金(2015JQ5176)
西安工程大学研究生创新基金(CX201605)
