摘要
介绍了一种多靶磁控溅射镀膜设备,阐述了镀膜室、工件台、阴极溅射靶、辅助离子源、真空系统等关键部件的设计思想。镀膜工艺结果显示,设备满足工艺要求,膜层均匀性优于±3%。
The design of a multi-target magnetron sputtering coating equipment was introduced.Sputtering targets,workpiece table,vacuum system,assistant ion source were particularly described.Thickness uniformity of film is better than ±3%.
出处
《电子工业专用设备》
2016年第6期32-36,44,共6页
Equipment for Electronic Products Manufacturing
关键词
磁控溅射
溅射靶
离子源
Magnetron sputtering
Sputtering target
Ion source
