摘要
陶瓷球栅封装阵列(CBGA)器件的陶瓷器件与印制电路板之间热膨胀系数的差异是导致焊点失效的主要因素,其可靠性一直是CBGA封装器件设计时需重点考虑的问题^([1])。对CBGA植球器件的板级表贴焊点在-55~105℃温度循环载荷条件下的失效机理进行了研究,结果表明,CBGA板级表贴器件的焊点的主要失效部位在陶瓷一侧焊料与焊球界面和焊点与焊盘界面两处,边角焊点优先开裂,是失效分析的关键点;随着循环周期的增加,内侧链路依次发生断路失效。
The difference of thermal expansion coefficient between ceramic device and PCB of CBGA device is the main factor causing the failure of solder joint, and the reliability of solder joint has become a significant consideration while designing CBGA packaging device. The failure mechanism of board-level surface-mounted solder joint of CBGA device under the temperature cycling load within-55 ~105 ℃ is studied. The results show that the main failure parts of solder joint of CBGA board-level surface-mounted device are the interface between solder and solder ball as well as the interface between solder joint and pad. The corner joints crack firstly, which is the key point of the failure analysis. And with the increase of cycle periond, the inner links gradually break and fail.
出处
《电子产品可靠性与环境试验》
2016年第3期19-22,共4页
Electronic Product Reliability and Environmental Testing
