摘要
封装质量的好坏将直接影响到电子产品成本及性能,在IC封装中,有约1/4器件失效与材料表面的污染物有关,如何解决封装过程中存在的微颗粒、氧化层等污染物,提高封装质量变得尤为重要。本文进行了在线式等离子清洗的工艺优化,能够有效解决封装过程中由于污染物存在所导致的各种问题,提高封装质量及产品性能。
The quality of package directly affects the cost and performance of electronic products. In the IC package,there is the failure of the 1 /4 device to be related to the contamination of the material surface. It is particularly important on how to solve the problem of existence of the micro particles,oxide and other pollutants during the packaging process and improve the quality of packaging.In this paper,the on- line plasma cleaning process is optimized,which can effectively solve various problems caused by the presence of contaminants in the packaging process and improve the packaging quality and product performance.
出处
《山西电子技术》
2016年第3期53-54,82,共3页
Shanxi Electronic Technology
关键词
IC封装
工艺优化
等离子清洗
IC package
process optimization
plasma cleaning
