热塑性聚酰亚胺薄膜的制备与性能研究

Study on preparation and properties of thermoplasticity polyimide film

以自制的双[4-(4-氨基苯氧基)苯基]砜(BAPS)、4,4′-二氨基二苯醚(ODA)和3,3′,4,4′-二苯醚四甲酸二酐(ODPA)为主要原料,采用共聚法合成了较高黏度的聚酰胺酸(PAA)溶液;然后该PAA溶液经高温酰亚胺化后,制得了TPI(热塑性聚酰亚胺)薄膜。研究结果表明:所有样品均具有较好的尺寸稳定性和较低的吸水率,并具有一定的热塑性;当n(BAPS)∶n(ODA)=50∶50时,相应的TPI薄膜具有相对最好的综合性能,其基本完成了酰亚胺化的转变过程,具有较好的耐热性[玻璃化转变温度(Tg)约为249℃,热失重10%时的温度约为510℃,800℃时的残炭率约为18%]和优异的电绝缘性能(介电常数为2.5、介电损耗为0.001 2和体积电阻率为2.3×10^(13)Ω·m)。

With homemade bis[4-（4- amino phenoxy） phenyl] sulfone（BAPS）,4,4′- diamino diphenylether（ODA）and 3,3′,4,4′-diphenyl ether tetracarboxylic acid dianhydride（ODPA）as main raw materials,thepolyamide acid（PAA）solution with higher viscosity was synthesized by copolymerization. Then,the TPI（thermoplasticitypolyimide）film was prepared after the high temperature imide of PAA solution. The research results showed thatthe all samples had the better dimensional stability,lower water absorption,and a certain thermoplasticity. Thecorresponding TPI film had the relatively best combination property when molar ratio of n（BAPS）∶n（ODA）was 50∶50because it could basically complete the transformation process of imide,and had the better heat resistance[glasstransition temperature（Tg）at about 249 ℃,10% thermal weight loss temperature at about 510 ℃,800 ℃ carbonresidue rate at about 18% ] and excellent electric insulation property（dielectric constant at 2.5,dielectric loss at0.001 2,and volume resistivity at 2.3×10^13Ω·m）.