摘要
综合分析了Sn-Cu-Ni系无铅钎料的国内外研究现状,概述了Sn-Cu-Ni系无铅钎料的润湿性、微观组织、界面反应、力学性能、焊点可靠性、物理性能等性能特点。从钎焊工艺、添加微量元素等方面阐述了Sn-Cu-Ni系钎料各项性能的影响因素,并对Sn-Cu-Ni系钎料的应用前景和研究方向进行了展望。
In the article, a comprehensive review is done on the research status of Sn-Cu-Ni lead-free solders and the wettability, microstructure, interfacial reaction, mechanical properties, joint reliability and physical properties of the solders are discussed. Factors affecting solder properties, such as soldering process and trace elements addition, are highlighted. Meanwhile, the article also mentions the prospect and research orientation of Sn-Cu-Ni solders.
出处
《电子与封装》
2016年第6期1-9,共9页
Electronics & Packaging
关键词
无铅钎料
润湿性
微观组织
界面反应
lead-free solders
wettability
microstructure
interfacial reaction
