电子封装结构电源单元的热流耦合模拟及其优化设计

Heat and Flow Coupled Simulation and Optimization Design of Power Supply Unit for Electronic Packaging Structure

根据电子封装结构电源单元的产热与散热原理,应用傅立叶热传导方程、连续性方程及可压缩流体的NS方程建立了计算机电源单元的热流耦合模型,并研究PSU散热结构对铝制计算机电源单元内热流行为的影响。为降低计算成本和提高计算的可靠性,采用薄层特征对此类几何特征实体进行建模以减小薄壁几何的自由度,并定义了与栅板孔隙率相关的热损失系数。在兼顾避免电子元器件过热和防止空气粉尘吸入等前提下,采用关于孔隙率的参数扫描方法确定合适的栅板孔隙率范围。

According to the principles of heat production and heat loss for electronic packaging power unit,Fourier heat conduction equation,continuity equation and compressible navier-stokes equation were used to establish heat and flow coupling model of computer power supply unit,and to study the effects of PSU heat dissipation structure on the heat flow behavior in aluminum alloy computer power supply unit.To reduce the computational cost and improve the reliability of calculation,geometrical entities with thin layer characteristics was used to reduce the degrees of freedom of thin-wall geometry entity modeling,and heat loss coefficient related to grating porosity was defined.To both avoid overheating electronic components and prevent the air dust suction,porosity parameters scanning method was used to determine the appropriate grid porosity.