基于田口试验设计的电镀工艺参数优化

Optimization of Electroplating Processes Based on Taguchi Method

电镀膜层厚度是评估电镀质量的重要指标,其受多种因素的影响,由于实际情况的复杂性,导致这些影响因素与膜层厚度呈现出不确定的相关关系。针对这一现象,结合Minitab 17软件平台,本文给出了一种基于田口试验设计的电镀工艺参数优化方法。首先,通过因果图分析确定影响膜层厚度较大的可控因素。其次,利用田口试验设计方法,以最少的试验次数推导出各可控因素对膜层厚度的影响程度,得出控制因素的最佳水平组合。最后,将优化结果应用于两组试验,结果证明,在不增加成本的前提下,采用优化后的电镀工艺参数,可以提高电镀膜层厚度的合格率。

Plating film thickness is an important evaluation index to electroplating quality, which is affected by many factors. However, the relationship between the film thickness and these factors is uncertain because of the complexity of the actual situation. In response to this phenomenon, by combining with Minitab 17 statistical software, a design optimization method of electroplating processes based on Taguchi method is presented. Firstly, the larger controllable factors are determined by Cause ＆ Effect Analysis. Secondly, the influence of various factors on the film thickness is deduced and the best combination of the control factors is obtained by using Taguchi Method with least test times. And finally, the optimization results are applied to two groups of tests. The results show that, using the optimized parameters in electroplating processes can improve the qualified rate obviously without any increase in cost.