硅晶片切割机主轴结构优化

Optimization of Spindle Structure of Silicon Wafer Cutting Machine

硅晶片切割机用于对硅锭进行切割,硅锭属于硬脆性材料,且切割过程是上千条钢线一起切割,这使得钢线的载体要承受相当大的载荷。对已有结构的硅晶片切割机进行结构优化,提高硅晶片切割机主轴的使用寿命,减少硅晶片切割机停机维修的成本,最终为企业提高经济效益。

Silicon wafer cutting machine used for cutting silicon ingots,silicon ingot belongs to hard brittle materials,and cutting process is thousands of bar steel wire cutting together,which makes the carrier of the steel wire to carry a considerable load. This paper aimed at the existing structure of the silicon wafer cutting machine,structure optimization,improve the service life of the silicon wafer cutting machine spindle,reduce the cost of silicon wafer cutting machine maintenance downtime, as, eventually improve the economic benefit for the enterprise.