摘要
集成电路的高复杂度和装配的高密度,使得只用单一的IEEE1149标准来进行电路的自测试已经不能满足需要,在研究IEEE1149.1、.4和.5三种标准的差异性和组合应用准则的基础上,设计了融合三种标准进行混合信号多级扫描的方法。并通过实验平台的搭建与测试,验证了该方法的可行性,为数模混合量的检测以及多模块间的组合测试提供了实用参考。
It cannot satisfy the need of circuit testing that using only a single IEEE1149 standard to carry out already because of the high complexity and density of integrated circuit. Researched the differences and combination rules of IEEE1149.1,.4 and.5, a test method was proposed for mixed signal build in test. Its availability was proved by results gained from the designed test platform. The research provided application reference for complex system test.
出处
《电子技术（上海）》
2016年第6期86-89,共4页
Electronic Technology
