加封装层的V形无芯片标签的识别

The Identification of the V-Shaped Chipless Tag with Package Layer

本文研究了加封装层的V形无芯片标签的散射特性及其识别方法.考虑了封装层对标签识别的影响,改进了识别公式;分别研究了封装层的厚度和介电常数不同时标签的散射场及识别,并将其与改进前的识别结果进行了对比.仿真结果表明:改进后的公式提高了识别精度,识别误差均在2°以内,且封装层厚度和介电常数越小识别越准确.为了验证仿真结果,对120°封装标签进行了实验测量.结果表明测量结果与仿真结果相吻合.

This paper studied the scattering characteristics and identification method of the V-shaped chipless tag with package layer.Firstly,influence of package layer was taken into account and formula of identification was improved.The scattered field and identification of tags packed by substrate with different thickness and dielectric constant were studied.The results before and after were compared.The simulation results show that the improved formula can improve identification accuracy and the identification errors are less than 2,as well as identification results are more accuracy when thickness and dielectric constant of package layer are smaller.In order to verify simulation results,120 tags with different package layers were conducted.The results show that experiment results are almost agreeable with simulation＇s.