TLP焊接工艺对接头界面元素扩散及力学性能的影响

Effect of TLP Welding Parameters on Element Ddiffusion in Interface and Mechanical Properties of Joints

采用铁镍非晶箔合金作中间层,母材为16Mn与304不锈钢,研究了焊接温度、保温时间和压力对瞬时液相扩散焊（TLP）焊接接头拉伸强度、中间层元素扩散的影响。通过电子探针分析了不同工艺参数下界面处元素的扩散深度,采用金相显微镜观察了各工艺参数下接头的金相组织。拉伸试验显示,其它参数不变,焊接温度为1200-1250℃时,拉伸断裂位置均发生在母材上,其中最大接头拉伸强度达到571 MPa;压力增加至6 MPa时,焊缝宽度降低到15μm左右,拉伸强度降至276 MPa;随着保温时间的增加,焊缝处出现少量脆性化合物。通过分析EPMA曲线,发现Ni、Mn、Si元素的扩散效果明显。

Transient liquid phase diffusion bonding （TLP） of 16Mn low alloy steel to 304 stainless steel was performed with FeNiCrSi foil as interlayer ,to investigate the effect of bonding temperature ,holding time and bonding pressure on tensile strength and element diffusion in the interface. The element diffusion depth of interface under different process parameters were analyzed by EPMA, and metallographic microstructure of joint welded were observed and analyzed by microscope. The results showed that the maximum tensile strength of joint was up to 571 MPa at 1200-1250℃ for other parameters remain unchanged, and the position of fracture in the base metal; When the pressure increased to 6 MPa, the weld width is reduced to about 15 μm, tensile strength decreased to 276 MPa. Along with the increase of holding time, a small amount of brittle compound is appeared in the weld. The elements of Ni、Mn.Si diffusion obviously by EPMA.