摘要
结合当今的电子产品发展方向,本文以一款叠孔HDI、陶瓷材料PCB为例,概述其制作难点,并就问题点提出改善方法。
By combining current electronic product development direction, this paper takes stacked up HDI stupalith PCB as an example, makes the overview of its production difficulties, and puts forward improvement methods on the problem.
出处
《印制电路信息》
2016年第7期12-17,26,共7页
Printed Circuit Information
关键词
高频微波
多阶高密度互连
叠孔板
陶瓷材料
High Frequency Micowave
High Steps HDI
Laminated Hole Plate
Stupalith
