摘要
随着电子产品朝多功能、多样化趋势发展,目前有部分PCB产品设计为埋铜基、埋电容等特征。本文主要介绍了埋铜板工艺制作前期设计思路、技术方案实施状况,重点阐述了制作过程中各工序制作难点及控制方法。
With the development of electronic products toward multi function, diversification trend, the PCB product is designed with buried copper base and buried capacitors. This paper mainly introduces the design ideas of the production and the implementation of the technical, and the control method of each working procedure.
出处
《印制电路信息》
2016年第7期18-21,共4页
Printed Circuit Information
关键词
紫铜板
工艺设计
填胶
Buried Copper
Process Planning
Filling Glue
