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覆铜板基材在落锤冲击载荷下的实验研究 被引量:1

The research of Copper Clad Laminate substrate under the drop impact load
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摘要 文章研究了覆铜板基材在落锤冲击载荷下产生的形变情况,这种不可恢复的形变在基材表面呈现为"十"字状的落痕,属于覆铜板基材特有。落痕的面积和长宽可以分别用软件和卡尺测量,其数据有较好的稳定性。用这两个指标来表征覆铜板基材的落锤冲击强度,并比较其与弯曲强度和层间粘合力的关系。 In this paper, the deformation of copper clad laminate substrate which was engendered under drop impact load was researched. This unrecoverable deformation was presented as a mark on the surface of the copper clad laminate substrate, like a cross pattern, which is unique for the copper clad laminate substrate. The area of the mark could be calculated by software, and the length and width of which could be measured by caliper. The result had a good stability. The two indicators were used to express the capability of drop impact, and the flexural strength and inter-ply adhesion strength were compared with them.
作者 吕吉 张红霞
出处 《印制电路信息》 2016年第7期37-40,共4页 Printed Circuit Information
关键词 覆铜板基材 落锤冲击 落痕面积 落痕长宽 弯曲强度 层间粘合力 Copper Clad Laminate Drop Impact Flexural Strength Ply adhesion Strength Area of the Mark Length and Width of the Mask
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