冰粒型固结磨具抛光锗片的温度场仿真与实验研究

Simulation of temperature field when polishing germanium wafer using ice-bonded-abrasive polishing pad

利用ABAQUS软件建立有限元分析模型,获得了冰粒型固结磨具在不同抛光时刻的温度场等温图及融化厚度值,并通过实验验证了有限元模型的结果。结果表明:摩擦生热并非是导致冰盘升温的主要原因,周围的空气对流换热对于温度场的影响较大,磨具温升速率为先快后慢;冰盘圆环带呈现中间温度高于两侧,外侧高于内侧的分布规律;摩擦生热效应随着抛光时间的增加逐渐显现;当抛光时间大于1366s,环境温度略高于0℃,气缸压力为20N,转速为200r/min时,冰粒型固结磨具具有好的自锐性和长的使用寿命。

The finite element model is established using ABAQUS to simulate the value of temperature fields for ice-bonded-abrasive pad polishing germanium wafer.Temperature contour map and melting thickness value of the pad are obtained and the results of FEM are verified by experiments.FEM results show that the main reason of ice melting is not frictional heat but air convection surrounding the tool.The pad temperature increases fast at the beginning and then slows down.The temperature in the middle of the pad is higher than those in the inner ring and outer ring and the outer ring temperature is higher than that in the inner ring.The thermic effect of friction is more and more obvious as time goes by.The ice-bonded-abrasive polishing pad has excellent self-sharpening performance and service life when polishing time is longer than 1366 s,ambient temperature higher than 0°C,cylinder pressure 20 N,and rotating speed 200r/min.