摘要
用数值模拟的方法,研究了散热面积为1cm^2带有层间微散热结构双面均热发热3D-IC内部流体层流流动与换热,对体积流量在36~290mL/min范围内,通道高度为200μm,通道间距为200μm的带有矩形微通道和叉排微针肋液体冷却3D-IC(three-dimensional integration circuit)的流动与换热进行了分析.结果表明:带有层间叉排微针肋液体冷却3D-IC具有良好的换热效果,在热流密度为1.25MW/m^2,体积流量为290mL/min时,其发热面平均温度、最大温度只有318.31,323.16K,分别最大减小了12.31,20.14K,此时的功率为250W、体积热源为8.3kW/cm^3.
The laminar flow and heat transfer characteristics of fluid were numerically investigated through uniform and double-side heat flux 3D-IC(three-dimensional integration circuit)with interlayer heat-removal structure for heat transfer areas of 1cm^2 and volume flow ringing from 36mL/min to 290mL/min.3D-IC with rectangle micro-channels and staggered micro-pin fins for pitches of 200μm and structure heights of 200μm was analyzed.Results show that inter-layer liquid cooling of 3D-IC with staggered micro-pin fins has better heat exchange effect than that with rectangle micro-channels.For the heat flux density of1.25MW/m^2,the average temperature and maximum temperature of the heating surface are only 318.31,323.16 K,decreased 12.31,20.14 Kthan that with rectangle micro-channels at the volume flow of 290mL/min,corresponding to about total power of 250 Wand volume heat source of 8.3kW/cm^3.
出处
《航空动力学报》
EI
CAS
CSCD
北大核心
2016年第6期1327-1334,共8页
Journal of Aerospace Power
基金
北京市自然科学基金(3142004)
关键词
三维集成电路
层间液体冷却
强化换热
对流
微针肋
three-dimensional integration circuit(3D-IC)
inter-layer liquid cooling
heat transfer enhancement
convection
micro-pin fin