基于ANSYS Workbench软件的半导体制冷器性能模拟研究

Performance Simulation on Semiconductor Cooler Based on ANSYS Workbench Software

利用ANSYS Workbench数值模拟软件研究了输入电压、热端温度、半导体单元属性、半导体电偶臂及级间绝缘材料属性等因素对二级半导体制冷器冷端温度、冷端冷量及制冷系数等性能的影响.研究表明:在一定范围内,保持半导体制冷器热端温度不变,冷端温度随着输入电压的增大而递减;保持输入电压不变,冷端温度随着热端温度的升高而递增;保持输入电压和热端温度不变,冷端冷量随着冷端温度的升高而递增;在冷端温度、热端温度一定时,制冷系数ε随着输入电压的增大而迅速减小;半导体单元高度的增加和单元间距的减小都可以使冷端达到更低温度;随着半导体电偶臂及级间绝缘材料属性即热导率、高度的增加,冷端温度均呈递增趋势.模拟结果与实验数据对比显示,两者具有较好的吻合性.

The finite element analysis on a two-stage semiconductor refrigeration device was carried out using the thermoelectric module in ANSYS Workbench software.The influences of the input voltage,hot end temperature,property of semiconductor unit,and properties of joint thermocouple arm and inter-stage thermal insulation materials on the cold end temperature and cooling capacity were studied.The simulation results show that the cold end temperature decreases with the increasing of input voltage when the hot end temperature keeps constant;the cold end temperature goes up with the increasing of hot end temperature when the input voltage keeps constant,which leads to the rising of cooling capacity;enlarging the height of semiconductor units and narrowing the spaces between them,and decreasing the thermal conductivity of joint couple arm and inter-stage insulation materials can lower the cold end temperature of semiconductor refrigerating device.The simulated results are in good agreement with the experimental results.