大容量电力电子器件结温提取原理综述及展望

Review and Prospect of Junction Temperature Extraction Principle of High Power Semiconductor Devices

电力生产、传输和消费方式的变革对大容量电力电子装备的可靠性提出了更高的要求。温度诱发的器件失效是电力电子系统失效的主要原因。因此,对器件结温的精确提取是大功率电力变换装备的寿命预测、健康管理和可靠性评估的基础。该文概述大容量电力电子器件结温提取原理和相关技术的最新进展,梳理现有器件结温检测技术的分类方法和主要特点,特别是对热敏感电参数提取方法的工作原理、典型特征进行总结和归纳,并从线性度、灵敏度、泛化度等指标对结温提取方法进行初步评估。在此基础上展望大容量电力电子器件结温提取的未来研究方向。

The great revolution of power production, transmission and consumption has led to an increasing demand for the reliable power converters with large-capacity. It is reported that temperature induced device failure is the most significant factor for the power electronics systems failure. The precise junction temperature extraction is essential for the aging estimation, state of health management and reliability assessment for the high power conversion systems. The state-of-the-art junction temperature measurement principles are thoroughly reviewed and compared. Especially, the temperature sensitive electrical parameter（TSEP） based method is detailedly introduced and evaluated from the criteria of linearity, sensitivity, genericity, etc. Finally, the major challenges and future possible research topics of on-line junction temperature extraction for high power semiconductor devices are summarized.