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热合装置PLC温度控制系统研究与开发 被引量:3

Research and Development of PLC Temperature Control System of Heating-sealing Device
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摘要 目的更精确地控制热合机热合装置的温度,提高热合装置压合袋口时的封口质量。方法提出了一种基于模糊自整定PID的温度控制器方案。把常规的PID控制方式同模糊控制结合起来,对PID参数进行在线修正。将常规PID和模糊PID温度控制算法在西门子PLC中编程实现,并将该方式与常规PID控制方式进行了对比。结果模糊控制方式较传统的PID控制能更稳定控制加热温度,有效提高了响应速度和控制精度。结论模糊PID温度控制系统具有更好的温度控制效果,能够提高热合装置的封口质量。 In order to more precisely control the temperature of heating-sealing device and improve the quality of pocket lamination, a design scheme for temperature controller was put forward based on fuzzy self-tuning PID. This design combined the traditional PID control mode and the fuzzy control and adjusted PID parameters online. It applied the traditional PID and the fuzzy PID control algorithms to the programming of Siemens PLC. Compared with the traditional mode, the fuzzy PID control method was more stable in controlling the heating temperature and effectively improved the response speed and the control accuracy. Fuzzy PID temperature control system has better effect on temperature control and can improve the sealing quality of heat-sealing device.
出处 《包装工程》 CAS CSCD 北大核心 2016年第13期128-133,共6页 Packaging Engineering
关键词 模糊PID PLC 热合装置 温度控制 fuzzy PID PLC heating-sealing device temperature control
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