摘要
以含硅芳炔树脂为基体,偶氮二甲酰胺(AC)为发泡剂,脲素为助发泡剂,通过树脂在固化的同时进行发泡,制备出工艺简单、结构基本可控的泡沫材料。研究结果表明,当泡沫材料密度约为0.578 g/cm^3时,泡孔直径约300μm,压缩强度为6.32 MPa,热导率为0.112 W/(m·K),介电常数为1.7左右。
The silicon-containing arylacetylene resin foam with controllable structure was prepared from siliconcontaining arylacetylene resin as matrix resin,azodicarbonamide（ AC） as blowing agent and urea as co-blowing agent by foaming while the resin is curing. Experimental results revealed that a silicon-containing resin foam which had a density of 0. 578 g / cm^3 has a cell diameter of 300 μm,a compression strength of 6. 32 MPa,a thermal conductivity of0. 112 W /（ m·K）,and dielectric constant of 1. 7.
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2016年第3期52-54,共3页
Aerospace Materials & Technology
关键词
含硅芳炔树脂
偶氮二甲酰胺
脲素
导热性能
Silicon-containing arylacetylene resin
Azodicarbonamide
Urea
Thermal conductivity
