期刊文献+

变频空调智能功率模块FSBB30CH60DA硬件电路设计

Hardware Circuit Design of Intelligent Power Module FSBB30CH60DA in the Frequency Conversion Air-conditioner
下载PDF
导出
摘要 随着变频空调的不断普及,智能功率模块的应用越来越广泛,本文研究变频空调中仙童功率模块FSBB30CH60DA的硬件电路设计,此功率模块电路性能可靠、成本低廉,实用性好。 With the continued popularity of frequency conversion air-conditioner, the application of intelligent power module is more and more widely. This paper studies the hardware circuit design of fair child power module FSB- B30CH60DA in the frequency conversion air-conditioner. It proves that this power module circuit has the characteristics of sable operation, low cost, and high value of utility.
作者 刘群群
出处 《日用电器》 2016年第1期32-35,共4页 ELECTRICAL APPLIANCES
关键词 智能功率模块 FSBB30CH60DA 变频空调 IPM FSBB30CH60DA frequency conversion air-conditioner
  • 相关文献

参考文献4

二级参考文献47

  • 1盛立峰,吴俊,梁国柱.R410A冷媒直流变频家用空调器的设计研讨[J].家电科技,2005(4):59-62. 被引量:2
  • 2邱民德,吴镇炜,姚辰.移动探查机器人监督式控制器的设计与实现[J].微计算机信息,2005,21(10Z):165-167. 被引量:1
  • 3C. Bailey, H Lu, T. Tilford. Predicting the Reliability of Power Electronic Modules[C], ICEPT, 2007.
  • 4S. Yang, D. Xiang, A. Bryant, P. Mawby, L. Ran and P. Tavner Condition Monitoring for Device Reliability in Power Electronic Converters - A Review[J]. IEEE Transactions on Power Electronics, vol.99, 2010.
  • 5S. Yang, A. Bryant, P. Mawby, D. Xiang, L. Ran and P. Tavner, An Industry-Based Survey of Reliability in Power Electronic Converters [J], IEEE Transaction on Industry Applications, 2011.
  • 6G. Coquery, R. Lallemand, D. Wagner, M. Piton, H. Berg, and K Sommer. Reliability improvement of the soldering thermal fatigue with AlSiC technology on traction high-power IGBT modules [C], in European Conference on Power Electronics and Applications (EPE), 1999.
  • 7T. Lee. Design optimization of an integrated liquid-cooled IGBT power module using CFD technique [J], IEEE Trans. on Components and Packaging Technologies, vol. 23, no. 1, pp. 55-60, 2000.
  • 8J. Lehmann, M. Netzel, R. Herzer, and S. Pawel. Method for electrical detection of bond wire lift-off for power semiconductor [C], in International Symposium on Power Semiconductor Devices & IC's (ISPSD), 2003.
  • 9L. Meysenc, M. Jylhakallio and P. Barbosa. Power Electronics Cooling Effectiveness Versus Thermal Inertia, IEEE Trans. on Power Electronics [J], Vol. 20, No. 3, 2005, pp.687-693.
  • 10Y. Han, Y. H. Song. Condition Monitoring Techniques for Electrical Equipment - A Literature Survey, IEEE Trans. on Power Delivery [J], vol. 18, no. 1, pp.4-13, Jan. 2003.

共引文献24

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部