摘要
大功率LED在节能和亮度方面的突出优势,得到了越来越的运用,如广场、草坪等环境。本文通过阐释大功率LED封装工艺的设计流程、重点参数、封装工艺等,分析了优化环节与措施,旨在为大功率LED的生产提供理论依据。
The outstanding advantage of High power LED is energy saving and brightness.High power LED is used more and more widely,such as squares,lawns and other environments.This paper describes the design of high-power LED packaging process,focus parameters,packaging technology,etc.,which provide a theoretical basis for the production of high-power LED based on Analysis and optimization measures.
出处
《工业技术创新》
2016年第3期514-517,共4页
Industrial Technology Innovation
基金
2014年广东省普通高校青年创新人才项目(2014KQNCX245)
关键词
大功率LED
封装工艺
设计优化
High Power LED
Packaging Process
Design Optimization
