摘要
为了提高多芯片组件的信号传输特性,用HFSS软件建立了多芯片组件的BGA-垂直通孔互联模型,分析垂直通孔半径、焊盘半径、反焊盘半径及信号线与地间的距离等结构参数对传输特性的影响。分析结果表明,该模型的回波损耗随着通孔半径和焊盘半径的增大而增大,随信号线与地间距离的增大而减小;特性阻抗随通孔半径和反焊盘半径的增大突变值达到最大。通过仿真分析得到传输性能较优的参数组合:通孔半径0.1mm,焊盘半径0.16mm,地层反焊盘半径0.325mm,信号线与地间距离0.06mm,可有效地减小特性阻抗的突变及信号的反射和延迟。
In order to improve the signal transmission characteristics of the multi-chip module,the BGA-via interconnection model was built in HFSS software,the impacts of structure parameters included via radius,bonding pad radius,anti-pad radius and distance between signal lines and ground on signal transmission characteristics were studied.The results show that the return loss of the multi-chip module BGA-via is increased with the increase of hole radius and pad radius,and the return loss of the multi-chip module BGA-via is decreased with the increase of the distance between the signal line and the ground.With the increase of via radius and anti-pad radius,characteristic impedance reaches the maximum.The structure parameters are obtained through the simulation analysis of signal transmission characteristics.Anti-pad radius is 0.325 mm,via radius is 0.1mm,pad radius is 0.16 mm and distance between signal line and ground is 0.06 mm.The characteristic impedance mutation,signal reflection and delay are effectively reduced.
出处
《桂林电子科技大学学报》
2016年第4期289-293,共5页
Journal of Guilin University of Electronic Technology
基金
国防973项目"多能量***研究"
